JPS6186885A - Ｉｃカ−ド - Google Patents

Ｉｃカ−ド

Info

Publication number
JPS6186885A
JPS6186885A JP59208795A JP20879584A JPS6186885A JP S6186885 A JPS6186885 A JP S6186885A JP 59208795 A JP59208795 A JP 59208795A JP 20879584 A JP20879584 A JP 20879584A JP S6186885 A JPS6186885 A JP S6186885A
Authority
JP
Japan
Prior art keywords
chip
fixed
sheet
frame
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59208795A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0417550B2 (en]
Inventor
Yoshitaka Fukuoka
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59208795A priority Critical patent/JPS6186885A/ja
Publication of JPS6186885A publication Critical patent/JPS6186885A/ja
Publication of JPH0417550B2 publication Critical patent/JPH0417550B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
JP59208795A 1984-10-04 1984-10-04 Ｉｃカ−ド Granted JPS6186885A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59208795A JPS6186885A (ja) 1984-10-04 1984-10-04 Ｉｃカ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59208795A JPS6186885A (ja) 1984-10-04 1984-10-04 Ｉｃカ−ド

Publications (2)

Publication Number Publication Date
JPS6186885A true JPS6186885A (ja) 1986-05-02
JPH0417550B2 JPH0417550B2 (en]) 1992-03-26

Family

ID=16562239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59208795A Granted JPS6186885A (ja) 1984-10-04 1984-10-04 Ｉｃカ−ド

Country Status (1)

Country Link
JP (1) JPS6186885A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2595848A1 (fr) * 1986-03-17 1987-09-18 Mitsubishi Electric Corp Carte a semi-conducteurs mince
US4909742A (en) * 1986-01-20 1990-03-20 Itt Corporation IC card and mating socket

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5881662U (ja) * 1981-11-29 1983-06-02 相合　征一郎 照合カ−ド
JPS5990184A (ja) * 1982-09-27 1984-05-24 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン デ−タカ−ドおよびその製造方法
JPS59140591A (ja) * 1983-01-31 1984-08-11 Sony Corp 携帯カ−ド

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5881662U (ja) * 1981-11-29 1983-06-02 相合　征一郎 照合カ−ド
JPS5990184A (ja) * 1982-09-27 1984-05-24 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン デ−タカ−ドおよびその製造方法
JPS59140591A (ja) * 1983-01-31 1984-08-11 Sony Corp 携帯カ−ド

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4909742A (en) * 1986-01-20 1990-03-20 Itt Corporation IC card and mating socket
FR2595848A1 (fr) * 1986-03-17 1987-09-18 Mitsubishi Electric Corp Carte a semi-conducteurs mince
US5031026A (en) * 1986-03-17 1991-07-09 Mitsubishi Denki Kabushiki Kaisha Thin semiconductor card

Also Published As

Publication number Publication date
JPH0417550B2 (en]) 1992-03-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term